The “dye and pry” technique, which relies on a liquid dye that penetrates into existing micro cracks or under open solder balls, is a destructive test method for the revealing of defects on the solder ball to pad interface (see figure below). On certain occasions some form of plus or minus pressure will be introduced. After letting the dye dry, the BGA is “pryed” off its PCB and the solder balls are inspected for the presence of the dye which reveals any inter-facial connection problem areas.
•Check BGA delamination
